2021 wholesale price Transformers - W25Q64JVSSIQ Non-Volatile FLASH 64Mb (8M x 8) SPI – Dual/Quad I/O SOP-8_208mil NOR FLASH RoHS – Ronghua

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Product Details

Features：
* New Family of SpiFlash Memories – W25Q64JV: 64M-bit / 8M-byte
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)
* Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
266/532MHz equivalent Dual/Quad SPI
– Min. 100K Program-Erase cycles per sector – More than 20-year data retention
* Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash
* Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply
– <1μA Power-down (typ.)
– -40°C to +85°C operating range
* Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume
* Advanced Security Features
– Software and Hardware Write-Protect
– Special OTP protection(1)
– Top/Bottom, Complement array protection – Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers
– Volatile & Non-volatile Status Register Bits
* Space Efficient Packaging
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-pad WSON 6×5-mm/8×6-mm, XSON 4×4-mm – 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-ball TFBGA 8×6-mm (6×4 ball array)
– 24-ball TFBGA 8×6-mm (6×4/5×5 ball array)
– Contact Winbond for KGD and other options